Die Bonder芯片焊接機

ESEC 2007LOC Die Bonder芯片銲接機 1台/Unit,Located in Taiwan,在台庫存,working condition,Sold As-It現況出售

$22,000.00

Please email to milin.wu@msa.hinet.net for purchase,Thanks.Negotiated price.
Price is EX-work.

ESEC 2007LOC Die Bonder
working condition.
Located in Taiwan
Sold As-It
3 Unit

 

欲購買請聯絡milin.wu@msa.hinet.net,謝謝。

報價為EX-work

ESEC 2007IC8  芯片銲接機

機器可運作
在台庫存
現況出售
庫存3台

1 in stock

Additional information

Weight 1500 kg
Dimensions 178 x 135 x 190 m

Reviews

There are no reviews yet.

Be the first to review “ESEC 2007LOC Die Bonder芯片銲接機 1台/Unit,Located in Taiwan,在台庫存,working condition,Sold As-It現況出售”

Your email address will not be published. Required fields are marked *